1. What is a PCB resin-filled Vias?
PCB resin filled Vias refers to a process technology of filling through hole, blind hole or buried hole with resin material (usually epoxy resin) in the manufacturing process of printed circuit board (PCB). By filling these holes with resin, the process makes the circuit board more solid and reliable, and improves its mechanical and electrical properties.
2. Why use resin-filled Vias?
There are several important reasons for using resin filled Vias technology, as follows:
① To prevent solder leakage:
In the process of surface mount device (SMT) welding, solder may leak to the other side of the circuit board through holes, which will affect the welding quality and electrical connection. Resin filled Vias technology can effectively seal holes, prevent solder leakage and ensure welding quality.
② Improve mechanical strength:
The filled holes enhance the mechanical strength of PCB, making it stronger and able to withstand higher mechanical stress. This is especially important for electronic products that need high reliability (such as automotive electronics, aerospace equipment, etc.).
③ Optimize thermal management:
The filled holes reduce the air gap inside the PCB, improve the thermal conductivity, help the heat dissipation of electronic components, prevent overheating and prolong the service life of components.
④ Prevent pollution:
The closed holes prevent pollutants (such as dust and moisture) from entering, protect the internal structure of the circuit board and ensure its long-term stable operation.
⑤ Support high-density interconnection (HDI) design:
For the high-density interconnection board, resin filled Vias technology can realize higher line density in a limited space and meet the requirements of miniaturization and high performance of modern electronic products.
⑥ Smooth surface:
After the resin is filled and cured, the surface of the hole is flat and consistent with the surrounding circuit board, which is helpful for the subsequent process (such as surface mounting) and ensures the surface flatness and mounting accuracy.
